TEST RESULTS CONCERNING
PLASTI DIP
CHEMICAL
RESISTANCE
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|
| CHEMICALS
USED |
STRENGTH |
TEMPERATURE |
RESISTANCE |
| Ferric
Chloride |
100% |
150
degrees F. |
Slight
staining and softness of film |
| H2SO4 |
5% |
100
degrees F. |
Pass |
| Potassium
Hydroxide |
3% |
150
degrees F |
Pass |
| Potassium
Permanganate |
3% |
150
degrees F |
Film
stable – noticed staining |
| Sodium
Hydroxide |
10% |
210
degrees F. |
Noticed softness of
film |
| Hydrochloric
Acid |
100% |
Room
Temp |
Pass |
| Oxalic
Acid |
50% |
Room
Temp |
Film
stable in chemical / water solution |
| Fluroboric Acid |
25% |
Room
Temp |
Pass |
| Tin/Lead – salt plating
solution |
100% |
Room
Temp |
Pass |
| Copper
– salt plating solution |
100% |
Room
Temp |
Pass |
| Gold
Cyanide – plating solution |
100% |
140
degrees F |
Pass |
| Sodium
Carbonate |
10% |
210
degrees F |
Pass |
| Sodium Hydroxide |
10% |
120 degrees F |
Noticed softness of
film |
| Ammonia
Hydroxide |
100% |
100 degrees F |
Pass |
| Methyl Ethyl
Ketone |
100% |
Room Temp |
Fail |
| Ethyl
Alcohol |
100% |
Room Temp |
Pass |
April
2002
|